Method of fabricating a microelectromechanical system (MEMS) device using a pre-patterned substrate
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United States of America Patent
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Nov 9, 2004
Grant Date -
Oct 31, 2002
app pub date -
Apr 26, 2001
filing date -
Apr 26, 2001
priority date (Note) -
Expired
status (Latency Note)
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Abstract
A method for fabricating MEMS structure includes etching a recess in an upper surface of a substrate that is bonded to a wafer that ultimately forms the MEMS structure. Accordingly, once the etching processes of the wafer are completed, the recess facilitates the release of an internal movable structure within the fabricated MEMS structure without the use of a separate sacrificial material.
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