High density modularity for IC's
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United States of America Patent
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Nov 9, 2004
Grant Date -
N/A
app pub date -
Feb 1, 1999
filing date -
Feb 1, 1999
priority date (Note) -
Expired
status (Latency Note)
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Abstract
A high density multi-chip module and method for construction thereof, wherein a plurality of integrated circuit dice with at least one row of generally central bond pads is bonded in a staggered flip-chip style to opposite sides of a metallized substrate. The bond pads of each die are positioned over a through-hole in the substrate, and the bond pads are wire-bonded from one side of the substrate to circuitry on the opposing side of the substrate. Application of a glob-top sealant into the through-holes seals the bond pads and bond wires. A ball grid array may be formed in the peripheral area surrounding the dice on one side of the substrate, or an edge connector may be incorporated for connection to an external circuit.
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