Thermoelectric module
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United States of America Patent
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Nov 9, 2004
Grant Date -
Jun 5, 2003
app pub date -
Oct 8, 2002
filing date -
Oct 11, 2001
priority date (Note) -
Expired
status (Latency Note)
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Abstract
An objective of the present invention is to provide a thermoelectric module which can achieve high heat release and heat absorption efficiencies and which can obviate any thermal stress-caused damages. A thermoelectric module (1) in an embodiment has a predetermined number of thermoelectric semiconductor elements P and N which are arranged in a flat plate configuration. Each of the thermoelectric semiconductor elements P and N has on one face thereof a one-side electrode (2) and has on the other face thereof an other-side electrode (3), thereby allowing all of the thermoelectric semiconductor elements P and N to be connected in series. The one-side electrodes (2, 2 . . . ) have heat release/heat absorption fins (heat transfer fins) (2F, 2F . . . ) and the other-side electrodes (3, 3 . . . ) have heat release/heat absorption fins (heat transfer fins) (3F, 3F . . . ).
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