Electrical connection between two faces of a substrate and manufacturing process
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Nov 9, 2004
Grant Date -
Jan 30, 2003
app pub date -
Aug 26, 2002
filing date -
Feb 28, 2000
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
Electrical connection between two faces of a substrate and manufacturing process. The connection is made by a part (46) of a conducting or semi conducting substrate (20) completely surrounded by at least one electrically insulating trench (32, 36, 44). A contact pad (42) is located on the back face (40) and conducting tracks (38) are located on the front face. The connection is made through the substrate itself. Application to the manufacture of circuits, components, sensors, etc.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Advertisement
Advertisement
Advertisement
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully