Pluggable electronic module and receptacle with heat sink
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United States of America Patent
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-
Nov 9, 2004
Grant Date -
Aug 28, 2003
app pub date -
Mar 5, 2003
filing date -
Mar 6, 2002
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
A receptacle assembly includes a guide frame having top, bottom and side walls joined to form an interior cavity configured to receive an electrical module. One of the top, bottom and side walls has an opening therethrough, and a heat sink is mounted over the opening. The heat sink has an engagement surface located proximate the interior cavity of the guide frame, and the engagement surface of the heat sink is configured to physically contact a module when installed in said interior cavity. The heat sink dissipates heat generated in the module and facilitates a data transmission rate of 10 Gbs through the assembly.
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