Interlock device with stamped lead frame
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United States of America Patent
Stats
-
Nov 16, 2004
Grant Date -
May 6, 2004
app pub date -
Nov 4, 2002
filing date -
Nov 4, 2002
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
An interlock device includes a housing and a toggle interlock mechanism with an extendable interlock pin. The interlock device also includes a preassembled switch, an electromechanical device, and a lead frame interconnecting the switch and electromechanical device. The lead frame conductors are formed as one piece, but are separated after assembly into the housing. The conductors and mating components include mating non-releasable contacts that telescope together in a manner that forms a robust assembly and that facilitates automation of the assembly process. A method related to the above is also disclosed.
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