Substrate processing method and substrate processing apparatus

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United States of America Patent

PATENT NO 6817790
SERIAL NO

10653999

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Abstract

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On the occasion of developing processing, a mixed solution produced by stirring a developing solution and a solution with a specific gravity smaller than the developing solution is supplied to the front surface of a substrate and left as it is for a fixed period of time. After the mixed solution is separated into two layers of which the lower layer is the developing solution and the upper layer is the solution, developing progresses all at once in the entire surface of the substrate. Hence, time difference in start time of developing does not occur in the surface of the substrate, thereby enabling uniform developing and an improvement in line width uniformity of a resist pattern film in the surface of the substrate.

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Patent Owner(s)

Patent OwnerAddress
TOKYO ELECTRON LIMITED3-1 AKASAKA 5-CHOME MINATO-KU TOKYO 107-6325 107-6325

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Orii, Takehiko Nirasaki, JP 82 1252
Toshima, Takayuki Nirasaki, JP 89 985

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