Thin film capacitor, method for manufacturing the same and printed circuit board incorporating the same
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United States of America Patent
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Nov 16, 2004
Grant Date -
Nov 27, 2003
app pub date -
May 27, 2003
filing date -
May 27, 2002
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A thin film capacitor is provided with a substrate having a thickness equal to or more than 2 .mu.m and equal to or less than 100 .mu.m; a lower electrode on the substrate, which includes at least a highly elastic electrode and an anti-oxidation electrode on the highly elastic electrode; a dielectric thin film on the first lower electrode; and an upper electrode on the dielectric thin film; wherein the highly elastic electrode is made of a material having a Young's modulus higher than that of the anti-oxidation electrode.
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