Method for manufacturing raised electrical contact pattern of controlled geometry
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United States of America Patent
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Nov 16, 2004
Issued Date -
N/A
app pub date -
Nov 7, 2002
filing date -
Nov 16, 1993
priority date (Note) -
Expired
status (Latency Note)
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Abstract
Spring contact elements are attached to terminals of an electronic component, which may be a semiconductor die. The spring contact elements may comprise a flexible precursor element. The precursor element may be over coated with a resilient material. The spring contact elements may be elongate and attached to the terminals at one end. The other end of the spring contacts may be spaced away from the electronic component.
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