Process for the non-galvanic tin plating of copper or copper alloys
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United States of America Patent
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Nov 23, 2004
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app pub date -
Jul 31, 2002
filing date -
Nov 12, 1999
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Abstract
The invention describes a process for non-galvanic tin plating of copper and copper alloys by precipitation of tin from methanesulphonic acid and tin-containing electrolytes, containing a complexing agent. In describing a process by which a durable tin layer which can be soldered is a created, which, at the same time, prevents liberation of the base material, this invention discloses that the electrolytes have at least one foreign metal added to form a diffusion barrier in the layer.
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