Electroetching methods and systems using chemical and mechanical influence

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 6821409
APP PUB NO 20030178319A1
SERIAL NO

10117991

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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The present invention applies an electrochemical etching solution to a material layer, preferably a metal layer, disposed on a workpiece, in the presence of a current. This electrochemical etching solution supplies to the material on the substrate surface the species to form an intermediate compound on the surface that can be more easily mechanically removed as intermediate compound fragments than the material. By removing the intermediate compound fragments, the process allows more efficient use of the supplied current to form another layer of intermediate compound that can also be mechanically removed, rather than using the current to result in another compound on the surface of the material that eventually dissolves into the solution. In another aspect of the invention, such intermediate compound particulates are externally generated and used to mechanically remove the surface layer of the material. Such intermediate particulates do not contaminate, and thus allow for more efficient material removal, as well as plating to occur within the same chamber, if desired.

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Patent Owner(s)

Patent OwnerAddress
NOVELLUS SYSTEMS INC4650 CUSHING PARKWAY FREMONT CA 94538

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Basol, Bulent M Manhattan Beach, CA 242 5316
Lindquist, Paul Milpitas, CA 8 79
Talieh, Homayoun San Jose, CA 132 5471
Uzoh, Cyprian E San Jose, CA 69 1641

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