Method of assembling a semiconductor chip package
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Nov 23, 2004
Grant Date -
Jul 10, 2003
app pub date -
Jan 29, 2003
filing date -
Dec 13, 1996
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
A method of encapsulating a microelectronic assembly comprises providing a microelectronic assembly having an element defining exterior surfaces and an array of terminals exposed at the exterior surfaces. The element defines an aperture through the exterior surfaces. A layer of a curable barrier material is screen printed onto a supporting element. The supporting element is assembled with the microelectronic assembly so that the layer of curable barrier material contacts the exterior surfaces and covers said one or more apertures. An encapsulant is applied to the microelectronic assembly.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Advertisement
Advertisement
Advertisement
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully