Method for encapsulating a topical composition
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United States of America Patent
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Nov 30, 2004
Grant Date -
N/A
app pub date -
Jul 24, 2002
filing date -
Nov 23, 1999
priority date (Note) -
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status (Latency Note)
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Abstract
A method of encapsulating a topical composition in a breakable capsule, includes the steps of elastically deforming at least a portion of a first deformable film that is impermeable to the composition so as to constitute at least one blister; injecting the topical composition into the blister; applying a second film that is impermeable to the composition onto the first film so as to close the blister; and sealing the second film and the first film together around the periphery of the blister, the portion of the first film being suitable for shrinking after release of the capsule so as to cause the pressure inside the capsule to be greater than atmospheric pressure. While the capsule is being made, at least one weak region is made in the blister, thus making the capsule suitable for being broken by exerting pressure on the capsule.
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