Micro-electromechanical assembly that incorporates a covering formation for a micro-electromechanical device
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United States of America Patent
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Nov 30, 2004
Issued Date -
N/A
app pub date -
Nov 17, 2003
filing date -
Jul 15, 1997
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A micro-electromechanical assembly includes a substrate that incorporates drive circuitry. A micro-electromechanical device is positioned on the substrate and is electrically connected to the drive circuitry to be driven by electrical signals generated by the drive circuitry. A covering formation is positioned on the substrate and is configured to enclose the micro-electromechanical device.
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