Circuit elements having an embedded conductive trace and methods of manufacture
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United States of America Patent
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-
Nov 30, 2004
Grant Date -
Nov 21, 2002
app pub date -
Apr 1, 2002
filing date -
Apr 2, 2001
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
Disclosed is a circuit element that includes a thermoplastic substrate and a conductive trace at least partially embedded in the thermoplastic substrate. Also disclosed is a method of forming a circuit element. The method includes the steps of providing a thermoplastic substrate having a softening temperature, printing a conductive ink onto the thermoplastic substrate to form a trace, and embedding the trace into the thermoplastic substrate by heating the thermoplastic substrate to a temperature above about the softening temperature about the trace.
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