Process for improving adhesion of resistive foil to laminating materials
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United States of America Patent
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Nov 30, 2004
Grant Date -
N/A
app pub date -
May 15, 2003
filing date -
May 15, 2003
priority date (Note) -
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Abstract
The invention relates to a process to enhance adhesion of resistive foil to laminating materials, including: providing a copper foil; depositing at least one resistive metal layer on at least one side of the copper foil; and applying at least one layer of at least one adhesion-promoting material over and adhered to the resistive metal layer, the adhesion-promoting material being suitable for enhancing adhesion between the resistive metal layer and laminating materials. The resistive metal layer may include NiCr, NiCrAlSi, aluminum, nickel, zinc, titanium, vanadium, chromium, manganese, iron, tantalum, molybdenum, ruthenium, and alloys, oxides, nitrides and silicides thereof. The invention further relates to a multilayer foil and to a laminate, both including the resistive metal layer and adhesion-promoting material.
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