Interconnection element with contact blade
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United States of America Patent
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Nov 30, 2004
Issued Date -
N/A
app pub date -
Jun 17, 2002
filing date -
Nov 10, 1998
priority date (Note) -
In Force
status (Latency Note)
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Abstract
An apparatus and method providing improved interconnection elements and tip structures for effecting pressure connections between terminals of electronic components is described. The tip structure of the present invention has a sharpened blade oriented on the upper surface of the tip structure such that the length of the blade is substantially parallel to the direction of horizontal movement of the tip structure as the tip structure deflects across the terminal of an electronic component. In this manner, the sharpened substantially parallel oriented blade slices cleanly through any non-conductive layer(s) on the surface of the terminal and provides a reliable electrical connection between the interconnection element and the terminal of the electrical component.
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