Lens cap for semiconductor laser package
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United States of America Patent
Stats
-
Nov 30, 2004
Grant Date -
Oct 23, 2003
app pub date -
Jun 6, 2002
filing date -
Apr 18, 2002
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A lens cap (40) in accordance with a preferred embodiment of the present invention for a semiconductor laser package (not shown) includes an optical element (31) made of a plastic material and a housing (20). The housing includes a top portion (21), a cylindrical sidewall (25) and an annular flange 22. An opening (23) is defined in the top portion. A ridge (24) is formed along an edge of the opening and protrudes into the opening. The optical element is insert molded into the housing, providing a strong structure which is not easily damaged, while still allowing transmittal of light through the opening. Since the optical element is made of a plastic material, the lens cap is comparatively inexpensive.
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Cited Art Landscape
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