Connection components with anisotropic conductive material interconnection
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United States of America Patent
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Nov 30, 2004
Grant Date -
Apr 10, 2003
app pub date -
May 6, 2002
filing date -
May 9, 2001
priority date (Note) -
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Abstract
A connection component for a microelectronic element includes a body of dielectric material having opposing first and second surfaces. A plurality of elongated leads extend through the body between the first and second surfaces. The leads have a first end accessible at the first surface and a second end accessible at the second surface. A layer of anisotropic conductive material overlies the first ends and the first surface of the body for electrical connection of the leads to a microelectronic element.
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