Forming conductive posts by selective removal of conductive material
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United States of America Patent
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Dec 7, 2004
Issued Date -
N/A
app pub date -
Nov 7, 2000
filing date -
Dec 29, 1994
priority date (Note) -
Expired
status (Latency Note)
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Abstract
A method of fabricating interconnection members for a microelectronic device. An electrically conductive sheet having a uniform thickness is coupled to a first surface of a support substrate. Portions of the conductive sheet are selectively removed so as to leave a plurality of substantially rigid, elongated posts protruding parallel to one another from surface of the support substrate.
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