Electrodeposition of metals in high-aspect ratio cavities using modulated reverse electric fields
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United States of America Patent
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Dec 7, 2004
Grant Date -
Apr 24, 2003
app pub date -
Oct 15, 2001
filing date -
Oct 15, 2001
priority date (Note) -
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Abstract
The interior of cavities and through-holes in electrically conductive substrates having high-aspect ratios of 8:1 or greater can be electroplated with a uniform layer of metal on their interior surfaces by using a pulse reverse voltage waveform having a pulse train of long cathodic pulses followed by short anodic pulses even in the absence of conventional additives such as levelers and brighteners.
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