Heat-sensitive adhesive material, method of preparing same and method of using same
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United States of America Patent
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Dec 7, 2004
Grant Date -
May 30, 2002
app pub date -
Sep 25, 2001
filing date -
Sep 29, 2000
priority date (Note) -
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Abstract
A heat-sensitive adhesive material including a substrate and a heat-sensitive adhesive layer provided thereon. The adhesive layer has one of the following properties (a) and (b): (a) the heat-sensitive adhesive layer, when thermally activated, exhibits an adhesive strength in the range of 1800-3500 gf/40 mm at 0-10.degree. C.; (b) the heat-sensitive adhesive layer, when thermally activated, exhibits a scratch resistance in the range of 150-500 gf at 0.degree. C.
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