Method for applying uniform pressurized film across wafer
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Dec 7, 2004
Issued Date -
N/A
app pub date -
Nov 6, 2002
filing date -
Aug 29, 2000
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
A method of manufacturing semiconductor devices using an improved planarization process for the planarization of the surfaces of the wafer on which the semiconductor devices are formed. The improved planarization process includes the formation of a flat planar surface from a deformable coating on the surface of the wafer using a fixed resilient flexible material member contacting the wafer.
First Claim
Family
International Classification(s)
- No Non-US Classification to display
Cited Art Landscape
Patent Citation Ranking
- No Patent Citation Ranking to display
Advertisement
Advertisement
Advertisement
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully