Flexible lead structures and methods of making same
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United States of America Patent
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Dec 7, 2004
Grant Date -
Apr 17, 2003
app pub date -
Nov 7, 2002
filing date -
Jul 7, 1994
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Abstract
An interconnect component comprises a compliant layer having a first surface and a plurality of electrically conductive leads having first ends and extending through the compliant layer. The first ends extend generally parallel to said first surface.
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