Modular cooling system and thermal bus for high power electronics cabinets
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United States of America Patent
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-
Dec 7, 2004
Grant Date -
Mar 27, 2003
app pub date -
Sep 26, 2001
filing date -
Sep 26, 2001
priority date (Note) -
In Force
status (Latency Note)
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Abstract
A modular cooling system (10) is provided for use in an electronics enclosure (12) mounting a plurality of heat generating electronic components (14). The cooling system (10) includes a cooling liquid supply manifold (16), a cooling liquid return manifold (18), and a plurality of cooling modules (20) that are selectively mountable into the electronic enclosure (12). The cooling system (10) also includes a wall (64) fixed in the enclosure to separate the electronic components (14) from the manifolds (16,18) to shield the electronic components (14) from any of the cooling liquid (52) should it leak from the system (10).
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