Method of liquid deposition by selection of liquid viscosity and other precursor properties

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United States of America Patent

PATENT NO 6830623
APP PUB NO 20020092472A1
SERIAL NO

10096893

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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A plurality of liquids, the flow of each controlled by a volumetric flowrate controller, are mixed in a mixer to form a final precursor that is misted and then deposited on a substrate. A physical property of precursor liquid is adjusted by adjusting the volumetric flowrate controllers, so that when precursor is applied to substrate and treated, the resulting thin film of solid material has a smooth and planar surface. Typically the physical property is the viscosity of the precursor, which is selected to be relatively low, in the range of 1-2 centipoise.

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Patent Owner(s)

  • MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.;SYMETRIX CORPORATION

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Hayashi, Shinichiro Osaka, JP 77 809
McMillan, Larry D Colorado Springs, CO 111 4273
Paz, de Araujo Carlos A Colorado Springs, CO 178 6203

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