Mold tool for an optoelectronic element

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United States of America Patent

PATENT NO 6830711
SERIAL NO

10336953

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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An optoelectronic component has a lens that is formed in the surface of an encapsulant surrounding a semiconductor diode element. With respect to emitters, the lens reduces internal reflection and reduces dispersion to increase overall efficiency. With respect to detectors, the lens focuses photons on the active area of the detector, increasing detector sensitivity, which allows a detector having a reduced size and reduced cost for a given application. The lens portion of the encapsulant is generally non-protruding from the surrounding portions of the encapsulant reducing contact surface pressure caused by the optoelectronic component. This non-protruding lens is particularly useful in pulse oximetry sensor applications. The lens is advantageously formed with a contoured-tip ejector pin incorporated into the encapsulant transfer mold, and the lens shape facilitates mold release.

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Patent Owner(s)

  • JPMORGAN CHASE BANK, N.A.

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Coffin, IV James P Trabuco Canyon, CA 5 4419
Mills, Michael A Mission Viejo, CA 18 7446

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