Method of manufacturing a thin film capacitor array
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United States of America Patent
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-
Dec 21, 2004
Grant Date -
Sep 12, 2002
app pub date -
May 8, 2002
filing date -
Mar 4, 1998
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
An electronic device has a plurality of capacitors in an ultra-small integrated package. The device has a plurality of terminal structures on one terminal side of the package to permit inverted mounting to a printed circuit board. The terminals are widely spaced, with the individual capacitors being located entirely in between. The device is produced on a suitable substrate using thin film manufacturing techniques. A lead-based dielectric having a high dielectric constant is preferably utilized for each capacitor to provide a relatively high-capacitance value in a relatively small plate area.
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