Wire saw and cutting method thereof
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Dec 21, 2004
Grant Date -
May 15, 2003
app pub date -
Oct 25, 2002
filing date -
Nov 30, 2001
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
When a work W is cut by moving a wire in an axial direction thereof while the wire is pressed onto the work and an abrasive liquid which is made by dispersing abrasive grains in a dispersion medium is interposed between the work and the wire, a flow of the wire is formed, and the wire is pressed onto the work while moving under the liquid level of the abrasive liquid whose flow is formed. The work is cut in the abrasive liquid so that a sufficient amount of the abrasive grains can be supplied between the work and the wire for a long time.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Advertisement
Advertisement
Advertisement
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully