Thermal preconditioning fixed abrasive articles
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United States of America Patent
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Dec 21, 2004
Grant Date -
N/A
app pub date -
Dec 3, 1999
filing date -
Dec 3, 1999
priority date (Note) -
Expired
status (Latency Note)
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Abstract
The CMP removal rate of a fixed abrasive article is increased and wafer-to-wafer uniformity enhanced by thermal preconditioning. Embodiments include preconditioning a fixed abrasive article by heating with hot water to a temperature of about 90.degree. C. to about 100.degree. C. to increase and stabilize the Cu or Cu alloy CMP removal rate.
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