Methods and apparatus for creating a high speed connection between a device under test and automatic test equipment
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United States of America Patent
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Dec 21, 2004
Grant Date -
Sep 9, 2004
app pub date -
Dec 1, 2003
filing date -
Mar 4, 2003
priority date (Note) -
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Abstract
A device-under test (DUT) assembly includes a DUT board having a plurality of spine assemblies. Each spine assembly has a first outer face, a second outer face, and a first plurality of contacts on at least one of the first and second outer faces in electrical contact with a subset of the first signal lines. A connector assembly includes a plurality of clamping assemblies arranged to receive the plurality of spine assemblies. Each clamping assembly includes a first inner face, a second inner face, and a second plurality of contacts on at least one of the first and second inner faces in electrical contact with a subset of the second signal lines. Electrical connections between the first and second contacts are formed when the first and second inner faces of each clamping assembly are clamped to the first and second outer faces of the corresponding spine assembly.
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