Substrate processing system and substrate processing method
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United States of America Patent
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-
Dec 21, 2004
Grant Date -
Jun 20, 2002
app pub date -
Dec 14, 2001
filing date -
Dec 14, 2000
priority date (Note) -
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status (Latency Note)
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Abstract
A substrate-processing system has several processing units, a loading/unloading section for transferring wafers to be processed to each unit and taking out processed wafers from each unit and a sub-arm mechanism for receiving/transferring the substrates from/to the loading/unloading section and transferring the substrates one by one to each unit. The processing units and the sub-arm mechanism are controlled by a controller so that each unit processes the substrates one by one in accordance with a one-cycle time that is the maximum period among periods t1/m to tn/m obtained by dividing periods t1 to tn by the number 'm' of identical units of each processing unit. The controller sets a pre-waiting time (before processing) for each processing unit.
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