Rigid plate assembly with polishing pad and method of using
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United States of America Patent
Stats
-
Dec 28, 2004
Grant Date -
Jun 19, 2003
app pub date -
Dec 14, 2001
filing date -
Dec 14, 2001
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
An apparatus according to the principles of the present invention includes a rotatable platen, a rigid plate member with a top surface and a bottom surface, includes pin members coupled to the rigid plate member which can be inserted into guide openings positioned within the rotatable platen, and a vacuum channel formed within the platen that enables removable mounting the rigid plate member to a top surface of the rotatable platen. The vacuum channel includes a cavity in the top surface of the platen. The rigid plate member adhesively holds the polishing pad to form a rigid plate assembly. A vacuum source coupled to the vacuum channel can be activated to create a vacuum within the vacuum channel to attract the rigid plate member to the platen. The platen can then used to polish work pieces contacting the polishing pad on the top surface of the rigid plate member.
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