Methods for molding a semiconductor die package with enhanced thermal conductivity
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United States of America Patent
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Dec 28, 2004
Grant Date -
Nov 27, 2003
app pub date -
May 24, 2002
filing date -
May 24, 2002
priority date (Note) -
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Abstract
A method and apparatus for assembling and packaging semiconductor die assemblies utilizes a coating element such as a wafer backside laminate formed on a backside of a semiconductor die. The coating element may be formed from a somewhat compressible and, optionally, resilient material, which seals against a surface of a mold cavity while the semiconductor die assembly is being encapsulated. In this manner, the coating element prevents encapsulant material from covering at least a portion of the backside of the semiconductor die to prevent encapsulant flashing over the backside and thus improve heat dissipation characteristics of the packaged semiconductor die during operation.
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