Lead frame and method for fabricating resin-encapsulated semiconductor device using the same
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United States of America Patent
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Dec 28, 2004
Issued Date -
N/A
app pub date -
May 16, 2003
filing date -
Feb 15, 2001
priority date (Note) -
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status (Latency Note)
Importance
Abstract
A lead frame includes: an outer frame section; a plurality of chip mounting sections which are supported by the outer frame section and on which a plurality of semiconductor chips are mounted; lead sections surrounding the chip mounting sections; connecting sections for connecting and supporting the lead sections and the outer frame section with each other; and an encapsulation region in which the chip mounting sections are encapsulated together in an encapsulation resin. An opening is provided in a plurality of regions of the outer frame section that are each located outside the encapsulation region and along the extension of one of the connecting sections.
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