Methods for transverse hybrid LOC package
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United States of America Patent
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Dec 28, 2004
Grant Date -
Aug 28, 2003
app pub date -
Feb 18, 2003
filing date -
Aug 20, 1998
priority date (Note) -
Expired
status (Latency Note)
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Abstract
A hybrid semiconductor package is formed from a die having two opposed elongate die edges with conductive bond pads arranged transversely relative to the rows of outer leads. A first portion of inner leads is off-die wire bonded to some of the bond pads, and a second portion of inner leads is insulatively attached as LOC leads between the bond pads along the opposed die edges. The hybrid package results in shorter inner leads of increased pitch enabling improved line yield at wire bond and encapsulation, as well as improved electrical performance, particularly for packages with very small dice.
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