Semiconductor device include relay chip connecting semiconductor chip pads to external pads
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United States of America Patent
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-
Dec 28, 2004
Grant Date -
Jan 29, 2004
app pub date -
Jan 21, 2003
filing date -
Jul 24, 2002
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
Disposal and replacement of bonding pads is conducted easily and accurately. A semiconductor chip that includes bonding pads is fixed on a die pad. A relay chip is fixed on the semiconductor chip via an insulating material. The relay chip includes bonding pads that are interconnected via a wiring pattern, which includes a single-layer or multi-layer interconnection structure, and convert the disposition of the bonding pads of the semiconductor chip to a different direction. The bonding pads of the semiconductor chip are connected to the bonding pads of the relay chip via wires, and the bonding pads of the relay chip are connected to bonding pads of a lead frame via wires.
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