Apparatus for connecting between substrates

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 6836024
APP PUB NO 20040222535A1
SERIAL NO

10430379

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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The present invention aims to provide an apparatus for connecting between substrates capable of replacing a connector one by one. An apparatus for connecting between substrates A is provided with a connector 100 for electrically connecting an upside electrode 11 mounted at the back surface of an upside substrate 10 and a downside electrode 21 mounted at the front surface of a downside substrate 20 in a personal computer and a supporting plate 200 arranged between the upside substrate 10 and the downside substrate 20 for removably supporting the connector 100, and the connector 100 is able to be inserted into a positioning hole formed on the supporting plate 200 and has a mounting terminal 110 having a leading edge section being in contact with the downside electrode 21 and a connecting section 120 mounted at a base edge section of the mounting terminal 110 and having a leading edge section being in contact with the upside electrode 11.

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Patent Owner(s)

Patent OwnerAddress
NIHON DENSHIZAIRYO KABUSHIKI KAISHA (REPRESENTATIVE HIDEO SAKANE)2-5-13 NISHINAGASU-CHO AMAGASAKI-SHI HYOGO HYOGO 660-0805

International Classification(s)

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Kawata, Masao Kumamoto, JP 30 387
Mori, Chikaomi Yamaga, JP 16 76
Nojiri, Kenichi Yamaga, JP 1 1
Takahashi, Hirotada Kumamoto-ken, JP 2 6

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