Test circuit, semiconductor product wafer having the test circuit, and method of monitoring manufacturing process using the test circuit
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United States of America Patent
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Dec 28, 2004
Grant Date -
Oct 10, 2002
app pub date -
Apr 5, 2002
filing date -
Apr 5, 2001
priority date (Note) -
In Force
status (Latency Note)
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Abstract
A test circuit and a method of monitoring a manufacturing process of a semiconductor integrated circuit using the test circuit are provided. The test circuit comprises elements to be tested; a selection circuit for sequentially selecting at least one of the elements at a time. The test circuit and pads used for testing the elements are placed within a scribe line on a semiconductor wafer.
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