MEMS element manufacturing method

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United States of America Patent

PATENT NO 6838304
APP PUB NO 20040077119A1
SERIAL NO

10468757

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Abstract

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The present invention is directed to manufacturing methods of electrostatic type MEMS devices. The manufacturing method of the present invention includes the steps of forming a substrate side electrode on a substrate, forming a fluid film before or after forming a sacrificial layer, further forming a beam having a driving side electrode on a planarized surface of the fluid film, and finally, removing the sacrificial layer. Furthermore, performing the foregoing method planarizes the surface of a driving side electrode, reduces fluctuations in the shape of a beam, and improves the performance and the uniformity of the MEMS device.

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Patent Owner(s)

Patent OwnerAddress
SONY CORPORATION7-35 KITASHINAGAWA 6-CHOME SHINAGAWA-KU TOKYO

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Ikeda, Koichi Kanagawa, JP 62 983
Kinoshita, Takashi Kanagawa, JP 125 1110

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