High frequency circuit chip and method of producing the same
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United States of America Patent
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-
Jan 4, 2005
Grant Date -
Sep 12, 2002
app pub date -
Mar 5, 2002
filing date -
Mar 5, 2001
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
In the production of a high frequency circuit chip in which a wiring pattern is disposed on a substrate having a through-hole, a connecting electrode of the through-hole is formed by filling electrically conductive paste into a perforation and firing it, and the wiring pattern is formed by a lift-off method. Moreover, at least the surface of the substrate for the wiring pattern to be formed thereon is mirror-polished, and thereafter, the wiring pattern is formed on the mirror-polished surface by the lift-off method.
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