Lead-frame strip and method of manufacturing semiconductor packages using the same
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United States of America Patent
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-
Jan 4, 2005
Grant Date -
Jun 26, 2003
app pub date -
Dec 23, 2002
filing date -
Dec 21, 2001
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
Provided are a lead frame strip and a method of fabricating a semiconductor package using the same. The lead frame strip includes at least one lead frame panel in which a plurality of unit lead frames are arranged to be connected with one another in matrix forms, wherein each unit lead frame includes: a die pad to which a semiconductor chip is to be mounted; a tie bar, an end of which being connected to the die pad and processed to be downset; a plurality of leads positioned at the same level as another end of the tie bar and extended with a predetermined distance from the tie pad; a dam bar formed across the leads and united with the leads to support the leads, wherein a slot is formed along edges of the lead frame panel and functions as a buffer, and a connection bar is formed widthwise across the slot to support the lead frame panel.
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