US Patent No: 6,839,964
Number of patents in Portfolio can not be more than 2000
Method for manufacturing a multi-layer printed circuit board
Stats
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Jan 11, 2005
Issued date -
Aug 8, 2002
filing date -
10/214,331
serial no -
In Force
status
Importance
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Abstract
A method of manufacturing a multilayer printed circuit board (PCB) is provided, the PCB having blind vias connecting to power layers. A portion of the blind vias in the power layers are grouped together to form a cluster of blind vias. Signal layers, provided separate from the power layers, include signal routing channels, with at least some of the signal routing channels aligned above or below the cluster of blind vias of the power layers.
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First Claim
Related Publications
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International Classification(s)
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Cited Art
| Patent Info | (Count) | # Cites | Year |
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| 4,868,350 High performance circuit boards | 29 | 1988 | |
| 4,864,722 Low dielectric printed circuit boards | 31 | 1988 | |
| 4,916,260 Circuit member for use in multilayered printed circuit board assembly and method of making same | 18 | 1988 | |
| 5,191,174 High density circuit board and method of making same | 111 | 1990 | |
| 5,225,777 High density probe | 55 | 1992 | |
| 5,371,654 Three dimensional high performance interconnection package | 214 | 1992 | |
| 6,378,201 Method for making a printed circuit board | 34 | 1995 | |
| 5,822,856 Manufacturing circuit board assemblies having filled vias | 160 | 1996 | |
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| 5,476,211 Method of manufacturing electrical contacts, using a sacrificial member | 353 | 1993 | |
| 5,917,707 Flexible contact structure with an electrically conductive shell | 288 | 1994 | |
| 5,806,181 Contact carriers (tiles) for populating larger substrates with spring contacts | 253 | 1997 | |
| 6,050,829 Making discrete power connections to a space transformer of a probe card assembly | 154 | 1997 | |
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| 5,534,784 Method for probing a semiconductor wafer | 116 | 1994 | |
| 5,554,940 Bumped semiconductor device and method for probing the same | 93 | 1994 | |
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| 5,488,542 MCM manufactured by using thin film multilevel interconnection technique | 54 | 1994 | |
| 6,121,554 Printed wiring board | 14 | 1997 | |
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| 5,509,200 Method of making laminar stackable circuit board structure | 55 | 1994 | |
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| 5,309,324 Device for interconnecting integrated circuit packages to circuit boards | 86 | 1991 | |
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| 5,912,809 Printed circuit board (PCB) including channeled capacitive plane structure | 122 | 1997 | |
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| 5,148,103 Apparatus for testing integrated circuits | 146 | 1990 | |
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| 5,557,502 Structure of a thermally and electrically enhanced plastic ball grid array package | 81 | 1995 | |
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| 5,045,975 Three dimensionally interconnected module assembly | 40 | 1989 | |
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| 4,837,622 High density probe card | 93 | 1988 | |
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| 5,786,701 Bare die testing | 60 | 1996 | |
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| 4,513,355 Metallization and bonding means and method for VLSI packages | 93 | 1983 | |
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| 4,799,128 Multilayer printed circuit board with domain partitioning | 56 | 1987 | |
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| 5,322,593 Method for manufacturing polyimide multilayer wiring substrate | 20 | 1992 | |
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| 4,668,332 Method of making multi-layer printed wiring boards | 22 | 1985 | |
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| 5,218,761 Process for manufacturing printed wiring boards | 24 | 1992 | |
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| 5,491,426 Adaptable wafer probe assembly for testing ICs with different power/ground bond pad configurations | 76 | 1994 | |
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| 5,363,280 Printed circuit board or card thermal mass design | 51 | 1993 | |
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| 5,464,950 Aluminum nitride circuit board and method of producing same | 10 | 1993 | |
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| 5,543,586 Apparatus having inner layers supporting surface-mount components | 72 | 1994 | |
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| 5,185,502 High power, high density interconnect apparatus for integrated circuits | 32 | 1990 | |
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| 6,249,924 Anti-roll off mattress construction | 18 | 1997 | |
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| 5,701,085 Apparatus for testing flip chip or wire bond integrated circuits | 37 | 1995 | |
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| 5,521,518 Probe card apparatus | 130 | 1991 | |
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| 6,653,574 Multi-layered substrate with a built-in capacitor design and a method of making the same | 5 | 2001 | |
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| 5,623,160 Signal-routing or interconnect substrate, structure and apparatus | 68 | 1995 | |
Patent Citation Ranking
Maintenance Fees
| Fee | Large entity fee | small entity fee | micro entity fee | due date |
|---|---|---|---|---|
| 11.5 Year Payment | $7400.00 | $3700.00 | $1850.00 | Jul 11, 2016 |
| Fee | Large entity fee | small entity fee | micro entity fee |
|---|---|---|---|
| Surcharge - 11.5 year - Late payment within 6 months | $160.00 | $80.00 | $40.00 |
| Surcharge after expiration - Late payment is unavoidable | $700.00 | $350.00 | $175.00 |
| Surcharge after expiration - Late payment is unintentional | $1,640.00 | $820.00 | $410.00 |