Method for manufacturing a multi-layer printed circuit board
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United States of America Patent
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Jan 11, 2005
Issued Date -
N/A
app pub date -
Aug 8, 2002
filing date -
Apr 14, 1998
priority date (Note) -
Expired
status (Latency Note)
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Abstract
A method of manufacturing a multilayer printed circuit board (PCB) is provided, the PCB having blind vias connecting to power layers. A portion of the blind vias in the power layers are grouped together to form a cluster of blind vias. Signal layers, provided separate from the power layers, include signal routing channels, with at least some of the signal routing channels aligned above or below the cluster of blind vias of the power layers.
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