Method and apparatus for detection of defects using thermal stimulation
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United States of America Patent
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-
Jan 11, 2005
Grant Date -
Feb 12, 2004
app pub date -
Apr 18, 2003
filing date -
Aug 25, 2000
priority date (Note) -
Expired
status (Latency Note)
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Abstract
A method for inspecting an object and detecting defects is taught (BGA and Flip-Chip solder joints on a PCB particularly). The method comprises injecting a thermal stimulation on the object; capturing a sequence of consecutive infrared images of the object to record heat diffusion resulting from the heat pulse; comparing the heat diffusion on said object to a reference; and determining whether the object comprises any defects. Also described is a system comprising a mounting for mounting the object; a thermal stimulation module for applying a thermal stimulation to the bottom surface of the object; an infrared camera for capturing infrared images of the object on the top surface of the object to record a change in infrared radiation from the top surface resulting from the thermal stimulation; and a computer for comparing the change in infrared radiation within a region on the top surface to a reference and determining whether the object comprises any defects.
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