Wafer edge polishing system
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United States of America Patent
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Jan 11, 2005
Grant Date -
Jul 17, 2003
app pub date -
Jan 13, 2003
filing date -
Jan 15, 2002
priority date (Note) -
Expired
status (Latency Note)
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Abstract
Disclosed is a wafer edge polishing system which improves the throughput and reduces the average processing cost. The system incorporates a wafer inspection unit. A wafer is polished in a wafer edge polishing unit and carried by a carrier unit to the wafer inspection unit where the polished surfaces of the wafer is inspected, and if it is judged as poorly polished, it is re-carried to the wafer edge polishing unit by the carrier unit.
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