Substrate processing apparatus equipping with high-pressure processing unit
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United States of America Patent
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Jan 11, 2005
Grant Date -
Jan 30, 2003
app pub date -
Jul 23, 2002
filing date -
Jul 27, 2001
priority date (Note) -
In Force
status (Latency Note)
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Abstract
With respect to any one of processing units, a main transportation path, a developing unit, a dedicated transportation robot and a high-pressure processing unit are disposed linearly in this order in a direction. Hence, even if a processing fluid adhering to a substrate or an evaporant of the processing fluid moves toward the main transportation path while the high-pressure processing unit transports the substrate wet with the processing fluid, there are the processing units located which the processing fluid or its evaporant must arrive at before reaching the main transportation path.
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