Saw and etch singulation method for a chip package
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United States of America Patent
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Jan 11, 2005
Grant Date -
N/A
app pub date -
Jun 19, 2002
filing date -
Jun 19, 2002
priority date (Note) -
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Abstract
A method of fabricating semiconductor packages from a lead frame strip which includes a mold cap applied to one side thereof, and defines a multiplicity of lead frames integrally connected to each other by connecting bars which extend in multiple rows and columns and define saw streets. In the singulation method of the present invention, the mold cap is sawed along the saw streets to expose the connecting bars. Thereafter, the connecting bars are chemically etched to separate the lead frames from each other.
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