Electronic package having a flexible substrate with ends connected to one another
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Jan 11, 2005
Grant Date -
Oct 28, 2004
app pub date -
Apr 28, 2003
filing date -
Apr 28, 2003
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
An electronic package is provided, having a flexible substrate, a first plurality of conductors, and a second plurality of conductors. The flexible substrate has first and second portions with a fold portion between the first and second portions, and is folded at the fold portion to position the second portion over the first portion. Each one of the first plurality of conductors runs from the first portion over the fold portion onto the second portion. Each one of the second plurality of conductors runs from the first portion onto the second portion without running over the fold portion.
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