Semiconductor device utilizing pads of different sizes connected to an antenna
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Jan 11, 2005
Grant Date -
Oct 11, 2001
app pub date -
May 22, 2001
filing date -
Dec 26, 1996
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
Concerning a plurality of second bonding pads that are electrically connected with a plurality of first bonding pads provided on an IC chip and having a predetermined narrow pitch, a technique is disclosed that allows the plurality of second pads to be provided on the IC chip. This makes it possible to provide the second pads at desired positions. Accordingly, it becomes possible to form, by printing with a low accuracy, respective interconnections that connect the plurality of second pads with a plurality of electrodes provided on a substrate. Also, matching of positions is executed between the plurality of second pads and the plurality of electrodes formed on the substrate by printing. This matching makes it possible to electrically connect the second pads with the electrodes provided on the substrate in a such a manner that they are opposed to each other.
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