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Abstract

Structures and methods for vertical memory cell. The vertical memory cell includes a vertical metal oxide semiconductor field effect transistor (MOSFET) extending outwardly from a substrate. The MOSFET has a first source/drain region, a second source/drain region, a channel region between the first and the second source/drain regions, and a gate separated from the channel region by a gate insulator. A first transmission line is coupled to the first source/drain region. A second transmission line is coupled to the second source/drain region. The MOSFET is adapted to be programmed to have a charge trapped in at least one of a first storage region and a second storage region in the gate insulator and operated with either the first source/drain region or the second source/drain region serving as the source region.

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First Claim